- Fabricante：
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- Comair Rotron (1)
- Product Status：
-
- Material：
-
- Width：
-
- Length：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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9 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 TA... |
1 |
3,231
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-220 DU... |
1 |
2,349
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEAT SINK |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Comair Rotron | HEATSINK STAMP 9.... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Obtener cotización |
