Material:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Material Finish:
Imagen Parte Fabricante Descripción MOQ Valores Acción
6236BG Aavid, Thermal Division of Boyd Corporation
HEATSINK TO-220 CL...
1
RFQ
7,589
In-stock
Obtener cotización
ATS-PCB1060 Advanced Thermal Solutions Inc.
HEATSINK TO-220 CO...
1
RFQ
402
In-stock
Obtener cotización
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