- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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2 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Wakefield-Vette | HEATSINK CPU 43MM... |
1 |
2,939
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK ASSY FO... |
1 |
50,000
In-stock
|
Obtener cotización |
