- Fabricante：
-
- CUI Devices (1)
- Material：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
2 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK BGA W/AD... |
1 |
84
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, BGA,25 X... |
1 |
1,440
In-stock
|
Obtener cotización |
