- Fabricante：
-
- CUI Devices (1)
- Material：
-
- Width：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
6 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions Inc. | HEATSINK AL6063 248X... |
1 |
98
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK AL6063 1220... |
1 |
2
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | PCIE EXTRUSION P... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | PCIE EXTRUSION P... |
1 |
1
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | PCIE EXTRUSION P... |
1 |
3
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, BGA, 30.... |
1 |
532
In-stock
|
Obtener cotización |
