- Fabricante:
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- Material:
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- Attachment Method:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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3 Registros
Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
---|---|---|---|---|---|---|---|
![]() |
Assmann WSW Components | HEATSINK CPU XCU... |
1 |
1,707
In-stock
|
Obtener cotización | ||
![]() |
CTS Thermal Management Products | HEATSINK CPU W/AD... |
1 |
2,166
In-stock
|
Obtener cotización | ||
![]() |
CTS Thermal Management Products | HEATSINK CPU W/AD... |
1 |
50,000
In-stock
|
Obtener cotización |