- Fabricante:
-
- Material:
-
- Attachment Method:
-
- Package Cooled:
-
- Thermal Resistance @ Forced Air Flow:
-
- Thermal Resistance @ Natural:
-
- Material Finish:
-
4 Registros
Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
---|---|---|---|---|---|---|---|
![]() |
Advanced Thermal Solutions Inc. | HEATSINK AL6063 300X... |
1 |
10
In-stock
|
Obtener cotización | ||
![]() |
Advanced Thermal Solutions Inc. | HEATSINK TO-220 BL... |
1 |
516
In-stock
|
Obtener cotización | ||
![]() |
Aavid, Thermal Division of Boyd Corporation | INTEL XEON CPU CO... |
1 |
50,000
In-stock
|
Obtener cotización | ||
![]() |
Advanced Thermal Solutions Inc. | HEATSINK AL6063 1220... |
1 |
4
In-stock
|
Obtener cotización |