- Product Status：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
7 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Wakefield-Vette | HEATSINK CPU 28MM... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK CPU 28MM... |
1 |
7,536
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK CPU 27.9M... |
1 |
2,792
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK FOR BGA... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK CPU 28MM... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK CPU 28MM... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK CPU 27.9M... |
1 |
50,000
In-stock
|
Obtener cotización |
