- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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4 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Wakefield-Vette | HEATSINK DPAK SM... |
1 |
15,011
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK TO-220 BO... |
1 |
4,829
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | 7.00" WIDE X 12" FLAT... |
1 |
12
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Obtener cotización |
