- Fabricante：
-
- CUI Devices (3)
- WEC (1)
- Material：
-
- Attachment Method：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
4 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,967
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEATSINK TO-220 2.3W... |
1 |
168
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEATSINK TO-220 2.3W... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
WEC | HEATSINK TO-220 2.3W... |
1 |
984
In-stock
|
Obtener cotización |
