- Material：
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- Attachment Method：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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3 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,219
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,205
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEATSINK TO-220 4.8W... |
1 |
1
In-stock
|
Obtener cotización |
