- Fabricante：
-
- Comair Rotron (1)
- Wakefield-Vette (6)
- Product Status：
-
- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
8 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
137
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK CPU 43MM... |
1 |
5,432
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK CPU 43MM... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK FOR 45MM... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK FOR 45MM... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK TO PKG F... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Comair Rotron | HEATSINK STAMP 24... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK FOR 45MM... |
1 |
50,000
In-stock
|
Obtener cotización |
