- Fabricante：
-
- CUI Devices (2)
- WEC (1)
- Material：
-
- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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3 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 4.7W... |
1 |
766
In-stock
|
Obtener cotización | ||
|
|
WEC | HEATSINK TO-220 4.7W... |
1 |
959
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtener cotización |
