- Attachment Method：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
4 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 3.6W... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEATSINK TO-220 3.6W... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEATSINK TO-220 3.6W... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEATSINK TO-220 3.6W... |
1 |
50,000
In-stock
|
Obtener cotización |
