- Fabricante：
-
- CUI Devices (1)
- Wakefield-Vette (6)
- Material：
-
- Length：
-
- Attachment Method：
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- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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10 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions Inc. | HEATSINK AL6063 300X... |
1 |
307
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK 19X15MM F... |
1 |
454
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK 19X15MM S... |
1 |
94
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK 23X12MM F... |
1 |
58
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, BGA, 23 ... |
1 |
4
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-220 BL... |
1 |
7,593
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK 23X12MM D... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK 23X12MM S... |
1 |
67
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK 19X15MM D... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK AL6063 1220... |
1 |
50,000
In-stock
|
Obtener cotización |
