- Fabricante：
-
- CUI Devices (1)
- Wakefield-Vette (3)
- Product Status：
-
- Material：
-
- Type：
-
- Width：
-
- Length：
-
- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
9 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions Inc. | HEAT SINK 50MM X 45... |
1 |
68
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 50MM X 45... |
1 |
902
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK 23X21MM F... |
1 |
99
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK 23X21MM S... |
1 |
92
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK 23X21MM D... |
1 |
87
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 37.5 X 37.5... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK 37.5X37.5X1... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-220 |
1 |
50,000
In-stock
|
Obtener cotización |
