- Fabricante：
-
- CUI Devices (1)
- Wakefield-Vette (3)
- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
10 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
2,908
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK 21X12MM S... |
1 |
446
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 27MM X 27... |
1 |
175
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | SUPERGRIP HEATSI... |
1 |
66
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 27MM X 27... |
1 |
221
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK 21X12MM F... |
1 |
66
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 40MM X 30... |
1 |
23
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEAT SINK 40MM X 30... |
1 |
9
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK 27X27X7.5M... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK 21X12MM D... |
1 |
5
In-stock
|
Obtener cotización |
