- Fabricante：
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- CUI Devices (1)
- Material：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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- Material Finish：
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2 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 18 ... |
1 |
1,105
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | 1/8 BRICK HEATSINK... |
1 |
105
In-stock
|
Obtener cotización |
