- Material:
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- Type:
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- Attachment Method:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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- Material Finish:
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4 Registros
Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
---|---|---|---|---|---|---|---|
![]() |
Aavid, Thermal Division of Boyd Corporation | TOP MOUNT HEATSI... |
1 |
13,140
In-stock
|
Obtener cotización | ||
![]() |
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-263 (D2... |
1 |
6,052
In-stock
|
Obtener cotización | ||
![]() |
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Obtener cotización | ||
![]() |
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Obtener cotización |