- Fabricante:
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- Wakefield-Vette (6)
- Product Status:
-
- Type:
-
- Attachment Method:
-
- Package Cooled:
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- Fin Height:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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9 Registros
Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
---|---|---|---|---|---|---|---|
![]() |
Wakefield-Vette | HEATSINK CPU 21MM... |
1 |
2,628
In-stock
|
Obtener cotización | ||
![]() |
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-5 1.25W... |
1 |
1,128
In-stock
|
Obtener cotización | ||
![]() |
Advanced Thermal Solutions Inc. | HEATSINK TO-126 BL... |
1 |
141
In-stock
|
Obtener cotización | ||
![]() |
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Obtener cotización | ||
![]() |
Wakefield-Vette | HEATSINK FOR 21MM... |
1 |
50,000
In-stock
|
Obtener cotización | ||
![]() |
Wakefield-Vette | HEATSINK FOR 21MM... |
1 |
50,000
In-stock
|
Obtener cotización | ||
![]() |
Wakefield-Vette | HEATSINK FOR 21MM... |
1 |
50,000
In-stock
|
Obtener cotización | ||
![]() |
Wakefield-Vette | HEATSINK FOR 21MM... |
1 |
50,000
In-stock
|
Obtener cotización | ||
![]() |
Wakefield-Vette | HEATSINK CPU 21MM... |
1 |
50,000
In-stock
|
Obtener cotización |