- Fabricante：
-
- Comair Rotron (1)
- Wakefield-Vette (6)
- Product Status：
-
- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
-
- Material Finish：
-
7 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Wakefield-Vette | HEATSINK CPU 25MM... |
1 |
2,958
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK FOR 25MM... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK FOR 25MM... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK FOR 25MM... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK FOR 25MM... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK CPU 25MM... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Comair Rotron | HEATSINK STAMP 13... |
1 |
50,000
In-stock
|
Obtener cotización |
