- Fabricante：
-
- CUI Devices (1)
- Wakefield-Vette (4)
- Product Status：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
7 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions Inc. | HEAT SINK 33MM X 33... |
1 |
36
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK 21X15MM F... |
1 |
99
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK 21X15MM S... |
1 |
99
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK 21X15MM D... |
1 |
81
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK 33X33X14.5M... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK EXTRUSI... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEATSINK TO-220 3.2W... |
1 |
50,000
In-stock
|
Obtener cotización |
