- Fabricante：
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- CUI Devices (2)
- Wakefield-Vette (1)
- Material：
-
- Type：
-
- Attachment Method：
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- Package Cooled：
-
- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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3 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEAT SINK PIN FIN... |
1 |
50,000
In-stock
|
Obtener cotización |
