- Fabricante：
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- Wakefield-Vette (4)
- Attachment Method：
-
- Package Cooled：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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5 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Wakefield-Vette | HEATSINK EXTRUSI... |
1 |
273
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | 5WX12" EXTRUSION 16... |
1 |
61
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | 5WX36" EXTRUSION 16... |
1 |
13
In-stock
|
Obtener cotización | ||
|
|
Delta Electronics | 77X68X48MM, AMD AM2/A... |
1 |
186
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK EXTRUSI... |
1 |
50,000
In-stock
|
Obtener cotización |
