- Fabricante:
-
- Product Status:
-
- Material:
-
- Type:
-
- Attachment Method:
-
- Package Cooled:
-
- Power Dissipation @ Temperature Rise:
-
4 Registros
Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
---|---|---|---|---|---|---|---|
![]() |
Assmann WSW Components | HEATSINK CPU XCU... |
1 |
2,491
In-stock
|
Obtener cotización | ||
![]() |
Assmann WSW Components | HEATSINK CPU XCU... |
1 |
3,523
In-stock
|
Obtener cotización | ||
![]() |
Assmann WSW Components | CPU HEATSINK, CRO... |
1 |
1,500
In-stock
|
Obtener cotización | ||
![]() |
CTS Thermal Management Products | HEATSINK VERT .375... |
1 |
50,000
In-stock
|
Obtener cotización |