- Fabricante:
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- Product Status:
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- Shape:
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- Attachment Method:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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7 Registros
Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
---|---|---|---|---|---|---|---|
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Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 EX... |
1 |
9,546
In-stock
|
Obtener cotización | ||
![]() |
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 BL... |
1 |
9,842
In-stock
|
Obtener cotización | ||
![]() |
Advanced Thermal Solutions Inc. | HEATSINK TO-220/TO... |
1 |
244
In-stock
|
Obtener cotización | ||
![]() |
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 PW... |
1 |
32
In-stock
|
Obtener cotización | ||
![]() |
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Obtener cotización | ||
![]() |
Advanced Thermal Solutions Inc. | HEATSINK TO-220 |
1 |
50,000
In-stock
|
Obtener cotización | ||
![]() |
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Obtener cotización |