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- Material:
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- Attachment Method:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Material Finish:
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4 Registros
Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
---|---|---|---|---|---|---|---|
![]() |
Assmann WSW Components | HEATSINK CPU FOR... |
1 |
1,771
In-stock
|
Obtener cotización | ||
![]() |
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 TA... |
1 |
1,851
In-stock
|
Obtener cotización | ||
![]() |
Assmann WSW Components | HEATSINK TO-220/TO... |
1 |
841
In-stock
|
Obtener cotización | ||
![]() |
Assmann WSW Components | HEATSINK ALUM AN... |
1 |
325
In-stock
|
Obtener cotización |