- Fabricante：
-
- Ohmite (2)
- Wakefield-Vette (2)
- Product Status：
-
- Material：
-
- Attachment Method：
-
- Fin Height：
-
- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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6 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1 |
1,768
In-stock
|
Obtener cotización | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
1,118
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK TO-220 W/P... |
1 |
2,007
In-stock
|
Obtener cotización | ||
|
|
Assmann WSW Components | HEATSINK CPU FOR... |
1 |
784
In-stock
|
Obtener cotización | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
108
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK TO-220 W/P... |
1 |
50,000
In-stock
|
Obtener cotización |
