- Fabricante：
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- Wakefield-Vette (2)
- Attachment Method：
-
- Package Cooled：
-
- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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3 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-218/TO... |
1 |
3,933
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK 40X40X23MM... |
1 |
56
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK 40X40X23MM... |
1 |
521
In-stock
|
Obtener cotización |
