- Fabricante：
-
- CUI Devices (1)
- Ohmite (1)
- WEC (1)
- Material：
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- Width：
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- Length：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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8 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 PO... |
1 |
5,602
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 SO... |
1 |
2,470
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-3 |
1 |
2,419
In-stock
|
Obtener cotización | ||
|
|
Ohmite | HEATSINK FOR TO-2... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
1 |
887
In-stock
|
Obtener cotización | ||
|
|
WEC | HEAT SINK, EXTRUS... |
1 |
701
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CTS Thermal Management Products | HEATSINK FORGED ... |
1 |
50,000
In-stock
|
Obtener cotización |
