- Fabricante：
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- Ohmite (2)
- Product Status：
-
- Material：
-
- Attachment Method：
-
- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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8 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CTS Thermal Management Products | HEATSINK PWR W/PI... |
1 |
1,532
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | EXTRUSION 300X51.6X... |
1 |
2
In-stock
|
Obtener cotización | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1 |
75
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEAT SINK |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CTS Thermal Management Products | HEATSINK PWR W/PI... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | HEAT SINK |
1 |
50,000
In-stock
|
Obtener cotización |
