- Fabricante:
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- Wakefield-Vette (1)
- Product Status:
-
- Material:
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- Width:
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- Length:
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- Attachment Method:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Material Finish:
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6 Registros
Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
---|---|---|---|---|---|---|---|
![]() |
Advanced Thermal Solutions Inc. | HEATSINK AL6063 248X... |
1 |
98
In-stock
|
Obtener cotización | ||
![]() |
Advanced Thermal Solutions Inc. | HEATSINK AL6063 1220... |
1 |
2
In-stock
|
Obtener cotización | ||
![]() |
Advanced Thermal Solutions Inc. | PCIE EXTRUSION P... |
1 |
3
In-stock
|
Obtener cotización | ||
![]() |
Wakefield-Vette | HEATSINK 19X19X12MM... |
1 |
50,000
In-stock
|
Obtener cotización | ||
![]() |
CTS Thermal Management Products | HEATSINK FORGED ... |
1 |
50,000
In-stock
|
Obtener cotización | ||
![]() |
CTS Thermal Management Products | HEATSINK HORZ .375... |
1 |
50,000
In-stock
|
Obtener cotización |