- Fabricante：
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- Wakefield-Vette (2)
- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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4 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Wakefield-Vette | HEATSINK 35X35X23MM... |
1 |
73
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEATSINK 35X35X23MM... |
1 |
218
In-stock
|
Obtener cotización | ||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
1 |
572
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT... |
1 |
50,000
In-stock
|
Obtener cotización |
