- Fabricante：
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- CUI Devices (1)
- Ohmite (1)
- Wakefield-Vette (4)
- Material：
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- Width：
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- Length：
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- Diameter：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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10 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions Inc. | HEATSINK AL6063 1220... |
1 |
10
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK AL6063 300X... |
1 |
11
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEAT SINK PIN FIN... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Ohmite | HEATSINK BLACK A... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
TE Connectivity AMP Connectors | HS ASSY CLIP |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEAT SINK ELLIP F... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEAT SINK PIN FIN... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | HEAT SINK ELLIP F... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CTS Thermal Management Products | HEAT SINK FORGED... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtener cotización |
