- Fabricante：
-
- Ohmite (1)
- Attachment Method：
-
- Package Cooled：
-
- Thermal Resistance @ Forced Air Flow：
-
- Material Finish：
-
3 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions Inc. | PCIE EXTRUSION P... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Ohmite | HEATSINK W/CLIP -... |
1 |
470
In-stock
|
Obtener cotización | ||
|
|
Assmann WSW Components | HEATSINK ALUM AN... |
1 |
100
In-stock
|
Obtener cotización |
