- Attachment Method：
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- Fin Height：
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- Thermal Resistance @ Forced Air Flow：
-
2 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 2.6W... |
1 |
749
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEATSINK TO-220 2.6W... |
1 |
52
In-stock
|
Obtener cotización |
