- Fabricante：
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- CUI Devices (2)
- Product Status：
-
- Material：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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6 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK TO-220/TO... |
1 |
1,244
In-stock
|
Obtener cotización | ||
|
|
Aavid, Thermal Division of Boyd Corporation | THM,ZA1831 ISS 3 TV-... |
1 |
348
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | ALUMINIUM HEAT S... |
1 |
63
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Advanced Thermal Solutions Inc. | HEATSINK TO-220 DU... |
1 |
50,000
In-stock
|
Obtener cotización |
