- Fabricante：
-
- CUI Devices (1)
- Ohmite (1)
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
2 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Ohmite | EXTRUDED HEATSIN... |
1 |
136
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEATSINK TO-220 4.8W... |
1 |
1
In-stock
|
Obtener cotización |
