- Fabricante：
-
- CUI Devices (4)
- WEC (1)
- Attachment Method：
-
- Package Cooled：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
5 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,974
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
2,009
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, BGA, 25 ... |
1 |
432
In-stock
|
Obtener cotización | ||
|
|
WEC | HEAT SINK, EXTRUS... |
1 |
930
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtener cotización |
