- Fabricante：
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- CUI Devices (2)
- Material：
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- Diameter：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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4 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
CTS Thermal Management Products | HEATSINK FORGED ... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
TE Connectivity AMP Connectors | 32.5MM HS ASSY ULTE |
1 |
50,000
In-stock
|
Obtener cotización |
