- Fabricante：
-
- Comair Rotron (1)
- CUI Devices (1)
- Product Status：
-
- Material：
-
- Attachment Method：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
6 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Assmann WSW Components | HEATSINK TO-263 12.7... |
1 |
2,257
In-stock
|
Obtener cotización | ||
|
|
Assmann WSW Components | HEAT SINK COPPER... |
1 |
19,441
In-stock
|
Obtener cotización | ||
|
|
Assmann WSW Components | HEATSINK TO-263 12.7... |
1 |
14,370
In-stock
|
Obtener cotización | ||
|
|
Assmann WSW Components | HEAT SINK COPPER... |
1 |
5,362
In-stock
|
Obtener cotización | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
1 |
1,967
In-stock
|
Obtener cotización | ||
|
|
Comair Rotron | HEATSINK STAMP 26... |
1 |
50,000
In-stock
|
Obtener cotización |
