- Fabricante：
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- Parker Chomerics (2)
- Material：
-
- Adhesive：
-
- Thermal Conductivity：
-
- Backing, Carrier：
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8 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Laird Technologies - Thermal Materials | THERM PAD 203.2MMX2... |
1 |
1,423
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 203.2MMX2... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 203.2MMX2... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Parker Chomerics | CHO-THERM T441 8X8" ... |
1 |
143
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | TPLI 210FG,A0,PC 8X8... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Parker Chomerics | CHO-THERM T441 8X8" ... |
1 |
86
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 203.2MMX2... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | GAP FILLER TPLI 2... |
1 |
50,000
In-stock
|
Obtener cotización |
