- Fabricante：
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- Parker Chomerics (4)
- Material：
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- Shape：
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- Adhesive：
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- Thermal Conductivity：
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- Backing, Carrier：
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7 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Parker Chomerics | CHO-THERM T500 8X8" ... |
1 |
36
In-stock
|
Obtener cotización | ||
|
|
Parker Chomerics | CHO-THERM T500 8X8" ... |
1 |
27
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 203.2MMX2... |
1 |
1,423
In-stock
|
Obtener cotización | ||
|
|
Parker Chomerics | CHO-THERM 1674 8X8" 0... |
1 |
114
In-stock
|
Obtener cotización | ||
|
|
Parker Chomerics | CHO-THERM 1674 8X8" 0... |
1 |
116
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | TPLI 210FG,A0,PC 8X8... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 203.2MMX2... |
1 |
50,000
In-stock
|
Obtener cotización |
