- Fabricante:
-
- 3M (TC) (2)
- Bergquist (2)
- Parker Chomerics (2)
- Product Status:
-
- Material:
-
- Thickness:
-
- Usage:
-
- Thermal Conductivity:
-
- Backing, Carrier:
-
- Thermal Resistivity:
-
14 Registros
Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
---|---|---|---|---|---|---|---|
Bergquist | THERM PAD 19.05MMX1... |
1 |
7,845
In-stock
|
Obtener cotización | |||
Bergquist | THERM PAD 19.05MMX1... |
1 |
9,736
In-stock
|
Obtener cotización | |||
Parker Chomerics | CHO-THERM 1671 TO-22... |
1 |
211
In-stock
|
Obtener cotización | |||
t-Global Technology | THERM PAD 19.05MMX1... |
1 |
143
In-stock
|
Obtener cotización | |||
t-Global Technology | THERM PAD 19.05MMX1... |
1 |
85
In-stock
|
Obtener cotización | |||
t-Global Technology | THERM PAD 19.05MMX1... |
1 |
50,000
In-stock
|
Obtener cotización | |||
t-Global Technology | THERM PAD 19.05MMX1... |
1 |
50,000
In-stock
|
Obtener cotización | |||
Laird Technologies - Thermal Materials | THERM PAD 19.05MMX1... |
1 |
1
In-stock
|
Obtener cotización | |||
t-Global Technology | THERM PAD 19.05MMX1... |
1 |
50
In-stock
|
Obtener cotización | |||
t-Global Technology | THERM PAD 19.05MMX1... |
1 |
50,000
In-stock
|
Obtener cotización | |||
3M (TC) | THERM PAD 19.05MMX1... |
1 |
50,000
In-stock
|
Obtener cotización | |||
Laird Technologies - Thermal Materials | THERM PAD 19.05MMX1... |
1 |
50,000
In-stock
|
Obtener cotización | |||
Parker Chomerics | CHO-THERM 1671 TO-22... |
1 |
50,000
In-stock
|
Obtener cotización | |||
3M (TC) | THERM PAD 19.05MMX1... |
1 |
50,000
In-stock
|
Obtener cotización |