- Fabricante：
-
- Würth Elektronik (1)
- Bergquist (1)
- Parker Chomerics (3)
- Material：
-
- Usage：
-
- Adhesive：
-
- Backing, Carrier：
-
- Thermal Resistivity：
-
5 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Bergquist | THERM PAD 19.05MMX1... |
1 |
4,479
In-stock
|
Obtener cotización | ||
|
|
Parker Chomerics | CHO-THERM 1674 TO-22... |
1 |
1,451
In-stock
|
Obtener cotización | ||
|
|
Parker Chomerics | CHO-THERM 1674 TO-22... |
1 |
901
In-stock
|
Obtener cotización | ||
|
|
Würth Elektronik | WE-TGF THERMAL GA... |
1 |
21
In-stock
|
Obtener cotización | ||
|
|
Parker Chomerics | CHO-THERM 1674 0.010" ... |
1 |
31
In-stock
|
Obtener cotización |
