- Fabricante:
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- CUI Devices (4)
- Material:
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- Thickness:
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- Thermal Conductivity:
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11 Registros
Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
---|---|---|---|---|---|---|---|
t-Global Technology | THERMAL PAD 30X30M... |
1 |
204
In-stock
|
Obtener cotización | |||
t-Global Technology | THERM PAD A6200 30X3... |
1 |
79
In-stock
|
Obtener cotización | |||
t-Global Technology | THERM PAD A6200 30X3... |
1 |
45
In-stock
|
Obtener cotización | |||
t-Global Technology | THERMAL PAD 30X30M... |
1 |
165
In-stock
|
Obtener cotización | |||
CUI Devices | THERMAL INTERFAC... |
1 |
50,000
In-stock
|
Obtener cotización | |||
CUI Devices | THERMAL INTERFAC... |
1 |
50,000
In-stock
|
Obtener cotización | |||
CUI Devices | THERMAL INTERFAC... |
1 |
50,000
In-stock
|
Obtener cotización | |||
t-Global Technology | THERMAL PAD 30X30M... |
1 |
1,289
In-stock
|
Obtener cotización | |||
t-Global Technology | THERM PAD A6200 30X3... |
1 |
428
In-stock
|
Obtener cotización | |||
t-Global Technology | THERM PAD A6200 30X3... |
1 |
273
In-stock
|
Obtener cotización | |||
CUI Devices | THERM PAD 30MMX30M... |
1 |
75
In-stock
|
Obtener cotización |