- Fabricante：
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- Thickness：
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- Usage：
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- Adhesive：
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- Thermal Conductivity：
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- Backing, Carrier：
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6 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
t-Global Technology | THERM PAD 31.75MMX3... |
1 |
98
In-stock
|
Obtener cotización | ||
|
|
Keystone Electronics | THERM PAD 31.75MMX3... |
1 |
473
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | THERM PAD 31.75MMX3... |
1 |
12
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | THERM PAD 31.75MM X... |
1 |
2
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 31.75MMX3... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | THERM PAD 31.75MMX3... |
1 |
50,000
In-stock
|
Obtener cotización |
