- Fabricante：
-
- Bergquist (2)
- Wakefield-Vette (1)
- Material：
-
- Type：
-
- Thickness：
-
- Adhesive：
-
- Thermal Conductivity：
-
- Backing, Carrier：
-
- Thermal Resistivity：
-
8 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Laird Technologies - Thermal Materials | THERM PAD 25.4MMX19... |
1 |
23,834
In-stock
|
Obtener cotización | ||
|
|
Bergquist | THERM PAD 25.4MMX19... |
1 |
25,078
In-stock
|
Obtener cotización | ||
|
|
Wakefield-Vette | THERM PAD 25.4MMX19... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Bergquist | THERM PAD 25.4MMX19... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 25.4MMX19... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 25.4MMX19... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 25.4MMX19... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 25.4MMX19... |
1 |
50,000
In-stock
|
Obtener cotización |
