- Material：
-
- Adhesive：
-
- Thermal Conductivity：
-
- Backing, Carrier：
-
4 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
t-Global Technology | THERMAL PAD 24X21.0... |
1 |
295
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | THERM PAD 24MMX21.0... |
1 |
417
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | THERMAL PAD 24X21.0... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
t-Global Technology | THERM PAD 24MMX21.0... |
1 |
50,000
In-stock
|
Obtener cotización |
