- Fabricante：
-
- Bergquist (1)
- Parker Chomerics (6)
- Material：
-
- Thickness：
-
- Usage：
-
- Adhesive：
-
- Thermal Conductivity：
-
- Backing, Carrier：
-
- Thermal Resistivity：
-
8 Registros
| Imagen | Parte | Fabricante | Descripción | MOQ | Valores | Acción | |
|---|---|---|---|---|---|---|---|
|
Parker Chomerics | CHO-THERM 1674 TO-22... |
1 |
996
In-stock
|
Obtener cotización | ||
|
|
Parker Chomerics | THERM PAD 35.81X20.57... |
1 |
372
In-stock
|
Obtener cotización | ||
|
|
Parker Chomerics | CHO-THERM T441 TO-2... |
1 |
473
In-stock
|
Obtener cotización | ||
|
|
Parker Chomerics | CHO-THERM T441 TO-2... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Parker Chomerics | CHO-THERM 1674 TO-22... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Essentra Components | THERM PAD 35.81MMX2... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Bergquist | THERM PAD 35.81MMX2... |
1 |
50,000
In-stock
|
Obtener cotización | ||
|
|
Parker Chomerics | CHO-THERM 1671 TO-24... |
1 |
50,000
In-stock
|
Obtener cotización |
